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In mobile communication base stations, the antenna is located at the top of the signal tower, and below the tower is the data center where the base station is placed. The base station is divided into two parts: BBU and RRU. BBU is used for signal processing, while RRU is used for signal transmission and reception. Generally, base stations will operate BBU and RRU separately, with BBU placed in the data center and RRU placed on the tower. The equipment connecting BBU and RRU is the optical module and fiber optic cable. In 4G networks, the optical modules used for connecting BBU and RRU are mainly gigabit to ten gigabit optical modules; In 5G networks, the optical modules used for BBU and RRU connections are mainly 25G speed. For example, the 1.25G SFP optical module uses a wavelength of 850nm, operates at a temperature of 0-75 ℃, has a power consumption of less than 1W, and is transmitted through multimode fiber with a transmission distance of 550m; The 10G SFP+optical module adopts a wavelength of 850nm, operates at a temperature of 0-75 ℃, consumes less than 1W of power, and is transmitted through multimode fiber with a transmission distance of 300m.

Huawei HiSilicon modules play an important role in mobile communication base stations. A base station usually consists of antennas, computer rooms, base stations (logically divided into BBUs responsible for signal processing and RRUs responsible for signal transmission and reception), feeders, supporting equipment, etc. The distributed site separates the base station BBU and RRU, with RRU hanging on the tower and BBU placed in the computer room. The devices connecting BBU and RRU are optical modules and fibers.

In 4G networks, the optical modules used for BBU and RRU connections are mainly gigabit to 10G optical modules; In 5G networks, interfaces between BBUs and RRUs such as CPRI (Common Public Radio Interface) or ECPRI (Enhanced Common Public Radio Interface) often use optical modules. Currently, 25Gbps optical modules are mainly used for 5G bearer network transmission.

In addition, the optical modules in the base station can also be used to achieve fiber optic return connections, transmitting the signals of the base station back to the data center or operator’s core network for monitoring base station performance, troubleshooting, and remote management. In the fiber to the antenna (FTTA) architecture, optical modules are also used to convert optical signals into electrical signals for wireless signal transmission and reception by the antenna. To improve the reliability and redundancy of base stations, fiber optic redundancy architecture is often used, and optical modules are used to achieve redundant connections of fibers. When one fiber optic fails, it can automatically switch to the backup fiber optic to ensure the continuous operation of the base station.

On September 11, 2024, Tyson Delo, Belgium – Melexis, a global microelectronics engineering company, announced the launch of the MLX90834 pressure sensor chip, carefully crafted for demanding automotive applications such as thermal management in electric vehicles, further enriching its Triphibian product line. This reliable, factory calibrated MEMS solution can accurately measure pressures ranging from 2 to 70 bar in gas and liquid media. Its digital SENT output can provide absolute pressure, diagnostic, and temperature information, helping the system achieve higher performance and reliability.

MLX90834 pressure sensor chip packaging diagram

The core competitive force of MLX90834 comes from the unique Triphibian technology of McLaren. This technology ensures the ability to accurately measure pressure in gas and liquid media through innovative MEMS sensor design, even in high-pressure environments up to 70 bar. This multifunctionality is achieved through a unique suspended beam arm and tip sensing membrane structure, cleverly encapsulated within a compact SO16 package.

Accurate monitoring of refrigerant pressure and temperature is crucial in the heat pump system of electric vehicles. To effectively avoid damage to high components in the system, it is necessary to prevent liquid media from entering the compressor. Therefore, the system must ensure that the refrigerant remains in a completely superheated gas state when it reaches the evaporator outlet. This can be achieved by accurately monitoring the pressure and temperature between the evaporator and compressor at the same location, allowing the system to use intelligent expansion valves to accurately calculate and regulate the degree of fluid overheating.

MLX90834 adopts Triphibian technology and is equipped with digital SENT output function, providing accurate pressure and temperature data for the system. This product supports external NTC and has undergone factory calibration to ensure measurement accuracy better than ± 1 ℃ over a wider temperature range. Accurate pressure measurement results can be used to derive the equivalent temperature of the medium in a saturated state (coexistence of liquid and gas in the evaporator), while NTC provides the actual temperature of the fluid.

The launch of MLX90834 provides strong support for the manufacturing of heat pump components such as intelligent expansion valves. By embedding this digital sensor chip into heat pump components such as valves, manufacturers can develop intelligent valves with edge computing capabilities. With the profound accumulation of sensing and driving technology in the field of Mindray, its motor drive chip can efficiently process the data provided by MLX90834. This fusion measurement technology enables heat pump manufacturers to directly integrate system regulation functions into components, greatly enhancing the overall value of their products: these locally controlled intelligent expansion valves have higher pressure and temperature sensing accuracy, effectively reducing overheating phenomena during the operation of heat pump systems, thereby improving the overall operating efficiency of the system.

MLX90834 has built-in sensor signal processing circuit, digital hardware, voltage regulator, and digital output driver chip. The piezoresistive element implanted in the sensing membrane can form a Wheatstone bridge to sense pressure signals. The signal is amplified and converted into a digital signal, temperature compensated through 16 bit digital signal processing (DSP), and finally output in digital (SENT) mode.

The sensor chip is equipped with advanced voltage protection mechanism, which can effectively resist damage from overvoltage (above+40V) and reverse voltage (below -40V), making it suitable for automotive and truck applications. In addition, MLX90834, as an independent safety unit (SEooC) compliant with ISO 26262 standard, supports ASIL C-level system integration and fully complies with the latest electric vehicle safety standards.

Laurent Otte, Product Line Director of Mailai Xin, said, “MLX90834 is a major breakthrough for our team based on Triphibian technology. It is not only a versatile and efficient pressure sensor product, but also performs well in the field of heat pump applications. Our excellent engineering team has successfully created this pressure sensor chip with a deep understanding and innovative applications of Triphibian technology. It not only has high flexibility and strong programmability, but also demonstrates excellent intelligent performance, which can flexibly meet and exceed the increasingly diverse needs of customers

Provide excellent performance reliability for consumer electronics, building automation, medical, and industrial applications

Chicago, September 10, 2024- Littelfuse Corporation (NASDAQ: LFUS), an industrial technology manufacturing company dedicated to powering a sustainable, interconnected, and safer world, announced the launch of the C&K Switch EL2 series of tactile switches. These standard sized surface mount technology (SMT) tactile switches are designed specifically for general switch applications, providing enhanced performance, higher component density, and higher reliability for various elec

ronic devices.

The EL2 series tactile switches stand out due to their market standard size design, IP67 level sealing, and versatility in various applications. The EL2 series has heights of 3.5 and 5.2 millimeters, with a driving force of 2 Newtons when lightly touched and a pressure of 3.5 Newtons when activated, ensuring seamless integration into existing designs while providing excellent contact reliability in dusty environments.

The EL2 tactile switch has the following main functions and advantages:
Market standard size design: ensures easy integration into various applications.
IP67 sealing: Provides high contact reliability and prevents dust and water from entering.
J-bend SMT packaging: Use a typical pick and place machine for standard component installation.

• Economically efficient: Very suitable for large-scale applications.

Littelfuse engineers are committed to solving layout size related issues for customers’ unique applications, as well as limitations in specific environments and electrical loads, “said Gavin Xu, Engineering Technology Development Manager of the Electronic Business Unit.” EL2 demonstrates the high-level design concepts of engineers and the careful planning of product management teams. The stability and reliability of EL2 are very suitable for applications in medical, high-precision instruments, consumer electronics, and other industries. “

The EL2 series tactile switch is very suitable for:
Consumer electronics products: small household appliances, white goods.
Industrial applications: automation, machinery, intelligent instruments, servers.
Transportation: Two wheeled vehicles.
Medical devices: portable medical devices.

The EL2 series has a lifecycle of 200000 cycles and an IP67 rating, ensuring long-term reliability and performance in various applications. The C&K tactile switch product portfolio has added the EL2 series, which meets basic tactile switch requirements and IP67 level sealing needs at a highly competitive price. The compact EL2 series tactile switch provides designers with the flexibility to integrate switches into standard and demanding applications.